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DATA SHEET
MOS FIELD EFFECT TRANSISTOR
PA502T
N-CHANNEL MOS FET (5-PIN 2 CIRCUITS)
The PA502T is a mini-mold device provided with two MOS FET circuits. It achieves high-density mounting and saves mounting costs.
PACKAGE DIMENSIONS (in millimeters)
0.32 +0.1 -0.05 0.65+0.1 -0.15 0.16+0.1 -0.06
* Two source common MOS FET circuits in package the same size as SC-59 * Complement to PA503T * Automatic mounting supported
2.8 0.2
FEATURES
1.5
0 to 0.1
0.95
0.95
0.8 1.1 to 1.4
1.9 2.9 0.2
PIN CONNECTION (Top view)
ABSOLUTE MAXIMUM RATINGS (TA = 25 C)
PARAMETER Drain to Source Voltage Gate to Source Voltage Drain Current (DC) Drain Current (pulse) Total Power Dissipation Channel Temperature Storage Temperature SYMBOL VDSS VGSS ID(DC) ID(pulse)* PT Tch Tstg RATINGS 50 20 100 200 300 (TOTAL) 150 -55 to 150 UNIT V V mA mA mW C C
* PW 10 ms, Duty Cycle 50 %
Document No. G11238EJ1V0DS00 (1st edition) Date Published June 1996 P Printed in Japan
1996
PA502T
ELECTRICAL CHARACTERISTICS (TA = 25 C)
PARAMETER Drain Cut-off Current Gate Leakage Current Gate Cut-off Voltage Forward Transfer Admittance Drain to Source On-State Resistance Drain to Source On-State Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time tr td(off) tf SYMBOL IDSS IGSS VGS(off) |yfs| RDS(on)1 RDS(on)2 Ciss Coss Crss td(on) VGS(on) = 5.0 V, RG = 10 VDD = 5.0 V, ID = 10 mA RL = 500 TEST CONDITIONS VDS = 50 V, VGS = 0 VGS = 20 V, VDS = 0 VDS = 5.0 V, ID = 1.0 A VDS = 5.0 V, ID = 10 mA VGS = 4.0 V, ID = 10 mA VGS = 10 V, ID = 10 mA VDS = 5.0 V, VGS = 0, f = 1.0 MHz 0.8 20 19 15 16 12 3 17 10 68 38 30 25 1.4 MIN. TYP. MAX. 1.0 1.0 1.8 UNIT
A A
V mS pF PF pF ns ns ns ns
Marking: DA
SWITCHING TIME MEASUREMENT CIRCUIT AND MEASUREMENT CONDITIONS (RESISTANCE LOADED)
DUT
RL
Gate Voltage Waveform
VGS 0 10 % VGS(on)
90 %
VDD RG PG. ID Drain Current Waveform 0 10 % 10 % ID 90 % 90 %
VGS 0 = 1 s Duty Cycle 1 %
td(on) ton
tr
td(off) toff
tf
2
PA502T
TYPICAL CHARACTERISTICS (TA = 25 C)
DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 350 Free air
PT - Total Power Dissipation - mW
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE
100
dT - Derating factor - %
300 250 200 150 100 50
Pe
TO TA
80 60 40 20
L
ro
ne
un
it
0
20
40
60
80
100 120
140 160
0
25
50
75
100
125
150
TC - Case Temperature - C DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE 120 100
ID - Drain Current - mA
TA - Ambient Temperature - C
TRANSFER CHARACTERISTICS 1000 VDS = 5 V Pulsed measurement
Pulsed measurement
4.0 V
ID - Drain Current - mA
3.5 V 80 60 3.0 V 40 20 VGS = 2.5 V
100
10 TA = 75 C 1 25 C -25 C 0.1
0
1
2
3
4
5
6
7
0
2
4
6
8
VDS - Drain to Source Voltage - V GATE TO SOURCE CUT-OFF VOLTAGE vs. CHANNEL TEMPERATURE 3
VGS(off) - Gate Cut-off Voltage - V
VGS - Gate to Source Voltage - V FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT 100
|yfs| - Forward Transfer Admittance - mS
VDS = 5 V ID = 1.0 A
VDS = 5 V
2
TA = 75 C 25 C 10 -25 C
1
1 -30 0 30 60 90 120 150 1 10 100 1000 Tch - Channel Temperature - C ID - Drain Current - mA
3
PA502T
RDS(on) - Drain to Source On-State Resistance -
DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 100 50
RDS(on) - Drain to Source On-State Resistance -
DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT 1000 500 VGS = 10 V Pulsed measurement
ID = 10 mA Pulsed measurement
10 5
100 50 TA = 75 C 25 C -25 C 10 10 50 100 500 1000
1 1 5 10 50 100 VGS - Gate to Source Voltage - V
ID - Drain Current - mA
RDS(on) - Drain to Source On-State Resistance -
DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 30 VGS = 10 V Pulsed measurement 100
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
Ciss, Coss, Crss - Capacitance - pF
Ciss 10 Coss Crss
20
10
1
VGS = 0 0 -30 0 30 60 90 120 150 0.1 f = 1 MHz 0.1 1 10 100
Tch - Channel Temperature - C
VDS - Drain to Source Voltage - V SOURCE TO DRAIN DIODE FORWARD VOLTAGE 100
SWITCHING CHARACTERISTICS 100
td(on), tr, td(off), tf - Switching Time - ns
td(off) 50 tf
ID - Drain Current - mA
VDD = 5 V VGS = 5 V RG = 10 50 100
10
tr 20 td(on)
1
10 10
20
0.1 0.4
0.5
0.6
0.7
0.8
0.9
1
ID - Drain Current - mA
VSD - Source to Drain Voltage - V
4
PA502T
REFERENCE
Document Name NEC semiconductor device reliability/quality control system Quality grade on NEC semiconductor devices Semiconductor device mounting technology manual Guide to quality assurance for semiconductor devices Semiconductor selection guide Document No. TEI-1202 IEI-1209 C10535E MEI-1202 X10679E
5
PA502T
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product.
M4 94.11

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